(+86)13828798939 Mr.Tony Tang derui@sz-derui.com 中文English

PCB Plating Line

Process:

Desmear/PTH、Panel Plating、Pattern Plating、Via Filling Plating、Gold/Nickel Plating、Immersion Nickel/Gold、Gold Finger

Technical characteristics of line:

1.Flexible and open programe.

2.Pepperl + Fuchs WCS positioning system.

3.Auto/Manual top racks.

4.Thin panel frame support.

5. Floating shield and push rods.

6. Bottom eductor/Side eductor.

7. Anode screen and up/down cathode shield.

8. Auto drip try on transporter.

9. Anode flightbar by transporter conveyed.

10.Service platform on transporter.

11.Auto loading/unloading.

12. Cup type auto dosing system.

13. Carbon treatment system for Copper plating.

14.Whole plant enclosed.